The GaSonics 7104 tool is a batch plasma system. Processing is accomplished at low temperature, and is used for surface treatment, descum, and cleaning organic material such as photoresist from metal, silicon and other assemblies.
An automated single-wafer photoresist asher. It is designed as a flexible downstream plasma photoresist removal system for high-volume wafer fabrication.
A downstream photoresist removal system. A damage-free asher with closed loop temperature control. 5 - 8 inch (125mm-200mm) wafer capability. This tool comes with optional integrated SMIF by Asyst.
This is a downstream RIE or isotropic plasma barrel asher/etcher system. It comes with the RF generator: Advanced Energy RFX-600 (AE RFX-600) and a refrigerated circulator: Remcor CFF-500.
A high throughput, single wafer system that specializes in photoresist removal. It is capable of handling a variety of substrates ranging from 3" to 6".
