Automatic batch low temperature plasma system for surface treatment and cleaning of organize metallic and composite substrates and assemblies. 75mm-1500mm wafer capability
Capability to Etch Vias and Contacts with Anisotropic or Sloped Profiles for Etching Silicon Dioxides, Silicon Nitrides and Polymides Tegal 903E Plasma Etch System Cassette to cassette single wafer plasma etcher system. 3" to 6" Wafer Capacity.
Load Lock Etcher 5 Gas Channel 2" to 6" Wafer Capacity.TEL 580LC Etch SystemFully Automated Microprocessor Control High-throughput Vacuum Load Lock Programmable Variable Electrode Spacing End Point Detection, Cassette to Cassette Load Five Gas Channel Maximum
