Surplus Process Equipment Corporation
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Image Product Details Inquiry
ASQ Technology Wafer Transfer Unit - 8-Inch

Model : AT2S8  - (2 available)

 
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August Technology / Nanometrics NSX-80 Automated Defect Inspection System

Automated vision-based defect-inspection system performs 25,000 pass/fail quality wafer and die checks a day compared to manually screening and classifying a few thousand die per day.

 
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Dektak 3030 Surface Profiler

Dektak 3030 Surface Profiler - Measures vertical features ranging in height from 131 micron to 50 angstroms on a variety of substrate surfaces.

 
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Dektak IIA (Sloan)
Surface Profile Measuring System, Capability up to 6".
 
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Electroglas Xynetics 1034X Wafer Prober with Station

This tool is designed to provide a high throughput capacity. It features a temptronics 4 inch thermal Chuck and Miller temperature controller.

 
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Electroglas Xynetics 1034X Wafer Prober with Station (2)

This tool is designed to provide a high throughput capacity. It features a temptronics 4 inch thermal Chuck and Miller temperature controller.

 
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Electroglas Xynetics 1034X Wafer Prober with Station (3)

This tool is designed to provide a high throughput capacity. It features a temptronics 4 inch thermal Chuck and Miller temperature controller.

 
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Electroglas Xynetics 1034X Wafer Prober with Station (4)
This tool is designed to provide a high throughput capacity. It features a temptronics 4 inch thermal Chuck and Miller temperature controller.
 
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InspecTech KIS 2000 Inspection System

An automatic system that inspects wafers that have already been diced. It inspects both sides of the the diced wafer for any chipping or cracking.

 
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KLA-Tencor 2131 Defect Inspection System Upgraded to 2132

High speed multilayer wafer inpsection for process defects inspection modes for arrayed and random patters. Works with 4"-8" wafers.

 
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KLA-Tencor 2131 Defect Wafer Inspection System

A high speed multilayer wafer inspection system for process defects for arrayed and random patterns. Works with 4" to 8" wafers.

 
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KLA-Tencor 2135 Defect Inspection System
A wafer inspection tool with advanced imaging technology in order to find any wafer defects. An improved version of the KLA-Tencor 2131 Wafer Defect Inspection System. Maximum Wafer size: 200mm
 
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KLA-Tencor 5100XP Overlay Measurement System
Wafer measurement module with wafer alignment capability. Also has software and hardware for overlap and CD Measurement. Works with multiple wafer sizes.
 
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KLA-Tencor 5200 Overlay Inspection System

An overlay inspection system with automatic arrayed target measurement and CPM advanced overlay.

 
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KLA-Tencor 6100 Surfscan Analysis System

A high precision laser scanning system for unpatterned wafers. This tool has advanced singal processing with 3-D displays. It is capable of handling 4" to 8" wafers.

 
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KLA-Tencor 6200 Surfscan Analysis System

A high precision laser scanning system for unpatterned wafers. It is capable of handling 4", 5", 6", and 8" wafers.

 
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KLA-Tencor 6200 Surfscan Analysis System

A high precision laser scanning system for unpatterned wafers. It is capable of handling 4", 5", 6", and 8" wafers.

 
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KLA-Tencor 6200 Surfscan Analysis System

A high precision laser scanning system for unpatterned wafers. It is capable of handling 4", 5", 6", and 8" wafers.

 
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KLA-Tencor 6200 Surfscan Analysis System

A high precision laser scanning system for unpatterned wafers. It is capable of handling 4", 5", 6", and 8" wafers.

 
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KLA-Tencor 6220 Surfscan Wafer Surface Inspection System
Non-Patterned Wafer Surface Inspection System.
Throughput 150 per hour of 200mm
Wafer Size 100,125,150,200 mm (4" to 8" Water Capability)

 
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KLA-Tencor 6220 Surfscan Wafer Surface Inspection System
Non-patterned wafer surface inspection system. This tool detects, counts, and sizes defects on bare wafers as well as wafers with smooth blanket film deposits.
 
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KLA-Tencor 7700 Wafer Inspection System (M) (2)

Patterned / Unpatterned wafer inspection system, that can detect defects as small as 0.15µm. it accommodates 4" - 8". Comes with microscope (M).

 
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KLA-Tencor AIT I (8020)

Automated full wafer inspection system for detecting particles as small as 0.10 micrometers on bare silicon and patterned process wafers.

 
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KLA-Tencor AIT I In-Line Defect Inspection System

Automated full water inspection system for detecting particles as small as 0.10 micrometers on bare silicon and patterned process wafers. High throughput of up to 30 full wafer scans per hour on 150mm wafers.

 
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KLA-Tencor FleXus FLX 2320

A 500°C thin film stress measurement system. It works with wafers up to 6" (though 8" is optional).

 
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