Automatic batch low temperature plasma system for surface treatment and cleaning of organize metallic and composite substrates and assemblies. 75mm-1500mm wafer capability
Capability to Etch Vias and Contacts with Anisotropic or Sloped Profiles for Etching Silicon Dioxides, Silicon Nitrides and Polymides Tegal 903E Plasma Etch System Cassette to cassette single wafer plasma etcher system. 3" to 6" Wafer Capacity.
