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Image Product Details Inquiry
ADE 8100 Microscan
WaferCheck 8100 system automatically measures and sorts 100 to 200mm wafers High speed belted sorter
 
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ADE EpiScan 1000
High-speed film thickness measurement and mapping tool. Capable of 4" to 8" Wafers.
 
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ADE Ultra Gage 9500

Multifunction Dimensional measurements for 500 nm Design Rule. Supports 4" to 8" wafer diameter.

 
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ADE Ultrascan 9300 Wafer Inspection / Sorter System

Non-Contact Capacitive Probe Measurement with 10nm Resolution, 400 to 1000 Microns Wafer Thickness Range. Capable of handling 100mm to 200mm Wafers.

 
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ADE Ultrascan 9350 Wafer Inspection System

Non-Contact Capacitive Probe Measurement with 10nm Resolution, 400 to 1000 Microns Wafer Thickness Range. Capable of handling 100mm to 200mm Wafers.

 
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APT Model:3455 Metal lift off system
APT Model:3455 Metal lift off system/coater
 
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Bio-Rad PT7150 RF Barrel Etcher
Automatic RF Plasma Barrel reactor with 10cm diameter chamber and 150W power
supply.
 
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Branson L400 Open Top Vapor Degreaser
Branson L400 Open Top Vapor Degreaser
 
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Canon PLA 501F Parallel Light Mask Aligner
Parallel Light Mask Aligner Cassette to cassette mask aligner can be used manually or in auto mode Mask aligner for 2"-5" wafers.
 
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Convergent 3000 Mask Coater with Bake

Convergent 3000 mask coater with bake.

Resist coat tool for mask substrates for use in advanced mask writing application.

 
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Dektak IIA (Sloan)
Surface Profile Measuring System, Capability up to 6".
 
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Estek Wis 600 Inspection System Wafer Surface Analysis System
Wafer Surface Analysis System Light and dark channel, Capability 3" to 6" wafers.
 
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Gasonics L3500(2)

GaSonics L3500 .PDF SPEC SHEET (click to view specifications)

 
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GaSonics L3500(3)

GaSonics L3500 .PDF SPEC SHEET (click to view specifications)

 
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InspecTech KIS 2000 Dicing Yield Maximizer
automatic system for inspecting diced semiconductor wafers up to 200 mm in diameter (with a 300 mm option).
 
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Intergrated Measurement Systems Inc. Three Scan Speeds

Intergrated Measurement Systems Inc. Three Scan Speeds

Scan Length: 50 Microns to 30MM, Tracking Force: 10 to 50MG.

 
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KLA / Tencor P20H Long Scan Profiler
Long Scan Profiler
Measurement of vertical features ranging from 100A to 0.3mm
 
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KLA 2131 Defect Inspection System
High Speed Multilayer Wafer Inspection For Process Defects Inspection Modes for Arrayed and Random Patterns- 4" to 8" Water Capability
 
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KLA 2131 Defect Inspection System Upgraded to 2132
High Speed Multilayer Wafer Inspection For Process Defects Inspection Modes for Arrayed and Random Patterns- 4" to 8" Water Capability
 
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KLA 2606 Defect Review Station
Review Station with Nikon BD Plan 10/20/60/100 Objectives
4" to 6" Water Capability
 
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KLA 2606 Defect Review Station (2)
Review Station with Nikon BD Plan 10/20/60/100 Objectives
4" to 6" Water Capability
 
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KLA Tencor 6200
Capable of handling 4", 5", 6" and 8" wafer submicron sensitivity, detects 0.10 micron particles.
 
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KLA Tencor 6200

Non-Patterned Wafer Surface Inspection System.
Throughput 150 per hour of 200mm
Wafer Size 100,125,150,200 mm

 
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KLA Tencor 7600M
KLA / Tencor 7600 Surfscan Patterned / Unpatterned Wafer Inspection System Can detect defects as small as 0.15 m Can measure defects on unpatterned wafers and measuring wafers from 4" to 8"
 
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KLA Tencor 7700(M) (2)

KLA / Tencor 7700 Surfscan Patterned / Unpatterned Wafer Inspection System, Can detect defects as small as 0.15 m, Can measure defects on unpatterned wafers and measuring wafers from 4" to 8"

 
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