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Multifunction Dimensional measurements for 500 nm Design Rule.
Supports 4" to 8" wafer diameter Multifunction Dimentional measurements for 500 nm Design Rule.
Supports 4" to 8" wafer diameter.
Measures thickness, shape stress, global and site flatness.
Capable of measuring 8,700 data points in less than 60 seconds.
2-D contour map.
Measurement functionality includes: Thickness - centerpoint, five point, and full wafer scan. Shape - Bow and Warp using 3-point or Best-Fit reference. Global Flatness - SEMI, GBI, TIR, FPD, FPD% Site Flatness - All Semi M1 standards with 8-30 millimieter site size and variable offsets.
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408-654-9500
