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The Karl Suss MA6 Mask Aligner/Exposure System Features/Specifications:

• Consists of basic equipment such as:
  • machine base with mechanical, pneumatic, and electrical equipment (230V/50Hz)
• Automatic wedge compensation in contact or without contact between mask and wafer (with reference balls), motorized Z-axis, and an alignment gap that is programmable from 0 to 300 micron; Resolution - 1 micron.
• Manual loading/unloading of wafers or substrates
• For wafers from 2" to 6" or substrates from 3" x 3" up to 6" x 6"
• Microprocessor control with LCD display
• Set reference and scan mode for pieces
• M306 Microscope, CPL MA/BA6
• Fiber optics tube: 2 arm (length 2400mm) with statistically mixed fibers for uniform illumination
• Objective axis distance: 40-140mm
• Objective 5X Olympus UMPL FL 5X - Working distance 20mm
• Objective 10X Olympus UMPL FL 10X - Working distance 10.1mm
• Objective 20X Olympus UMPL FL 20X - Working distance 12mm
• Turret Kit DVM6/8 - Three position turret nosepiece
• Microscope light source: 85W/LH1000 with yellow filter
• Halogen-illumination 13.8V/85W to be attached to MA/BA6 LH350
• Constant light intensity mode as well as constant power mode.

For more information about this tool or the series, click here.