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Karl Suss MA-6 Manual loading and unloading of wafers or substrates. For wafers 2" dia. up to 150mm dia. or substrates 3"x 3" up to 6"x 6"Karl Suss MA6 Mask Aligner / Exposure SystemBasic equipment consisting of: Machine base with mechanical, pneumatic and electrical equipment 230V/50Hz and 115V/60HzX-Y-Theta alignment stage with wedge compensation system and high precision micrometer screws for alignmentAutomatic wedge compensation in contact or without contact between mask and wafer (with reference balls), motorized Z-axis, alignment gap programmable from 0 to 300 micron, resolution 1 micronManual loading and unloading of wafers or substratesMicroprocessor control with LCD displayFor wafers 2" dia. up to 150mm dia. or substrates 3"x 3" up to 6" x 6"Set reference & scan mode for piecesDVM6 Dual Video Microscope, CPL MA/BA6:2-channel bright field microscope with: 2 CCD-camerasImage storing system DVCU consists of: Power supply, control unit, frame grabber, beam splitter inserter (electronic generation of a split-field), set of cables, B/W monitorMicroscope adapter DVM6/ MA/BA6Fiber optics tube 2 arm length 2400mm statistically mixed fibers for uniform illuminationObjective axis distance: 40-140mmObjective 5X Olympus UMPL FL 5X -Working distance 20mmObjective 10X Olympus UMPL FL 10X -Working distance 10.1mmObjective 20X Olympus UMPL FL 20X -Working distance 12 mmTurret Kit DVM6/8 -Three position turret nosepieceMicroscope Light Source 85W/LH350 -With yellow filter:Halogen-illumination 13.8V/85W to be attached to MA/BA6 LH350Exposure Unit MA6 350W:Optics housing and mirror housing with ellipsoidal mirror and surface mirrorFor wafer/substrate sizes up to 150mm diameter / 6" x 6"For exposure lamps up to 500WPrepared for use in combination with exposure optics optimized for high uniformity and high intensity for various wavelengths and applications:-Range of wavelengths: 250nm to 400nOptics UV400/PROX/CONT/W-150/LH350
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408-654-9500
