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This tool is a versatile downstream photoresist removal system. It utilizes the L-Series platform with programmable heating and process controls.
GaSonics L3510 Ashing System Features/Specifications:
- 75-200mm wafer capabilities (3-8in)
- PLaten and lamp heating for process flexibility
- High throughput (1.2µm blanket softbaked resist ashed to endpoint)
- Reliable endpoint detection
- Small footprint
- System performance matching
- SMIF Indexer (optional), AGV and robotic cassette loading
- Stand-alone or flush mount installation
- Ash rate: up to 3.5m./min
For more information about this tool, take a look at our brochure here.
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408-654-9500
