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Automated full water inspection system for detecting particles as small as 0.10 micrometers on bare silicon and patterned process wafers.
High throughput of up to 30 full wafer scans per hour on 150 mm wafers. High detection sensitivity even for difficult after-etch, develop, and chemical mechanical polishing. Double-dark field (DDF)laser scanning technology, the AIT is able to detect planar defects, microscratches and particulate contamination. Exceptional defect sensitivity. Reduced laser spot size concentrates the laser beam at the site of the defect, causing more light to scatter off the defect and less light to scatter off patern and surrounding surface. Double-dark field laser scattering design, which combines a low angle of illumination with multiple collection optics placed close to thewafer horizon-maximizing the capture of defects while minimizing the capture of surface scatter.
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408-654-9500
