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Karl Suss MA6 Mask Aligner / Exposure System
Unit with video backside alignment
Basic equipment consisting of: Machine base with mechanical, pneumatic and electrical equipment 230V/50Hz
Automatic wedge compensation in contact or without contact between mask and wafer (with reference balls), motorized Z-axis, alignment gap programmable from 0 to 300 micron, resolution 1 micron
Manual loading and unloading of wafers or substrates
Microprocessor control with LCD display
For wafers 2" dia. up to 150mm dia. or substrates 3"x 3" up to 6" x 6"
Set reference & scan mode for pieces
DVM6 Microscope, CPL MA/BA6:
Fiber optics tube 2 arm length 2400mm statistically mixed fibers for uniform illumination
Objective axis distance: 40-140mm
Objective 5X Olympus UMPL FL 5X -Working distance 20mm
Objective 10X Olympus UMPL FL 10X -Working distance 10.1mm
Objective 20X Olympus UMPL FL 20X -Working distance 12 mm
Turret Kit DVM6/8 -Three position turret nosepiece
Microscope Light Source 85W/LH1000 -With yellow filter:
Halogen-illumination 13.8V/85W to be attached to MA/BA6 LH350
Exposure Unit MA6
Optics housing and mirror housing with ellipsoidal mirror and surface mirror
For wafer/substrate sizes up to 150mm diameter / 6" x 6"
For exposure lamps up to 1000W
Prepared for use in combination with exposure optics optimized for high uniformity and high intensity for various wavelengths and applications:
-Range of wavelengths: 250nm to 400n
Optics UV400/PROX/CONT/W-150/LH1000:
Fly's eye, Herasil
Condensor lens, Herasil, dia. 55mm
Two lens plates, Herasil, conf. D
Front lens, transparent, dia. 180 mm
Lamp Power Supply
Constant light intensity mode
Constant power mode
Dual channel mode for 2-channel light sensors, with several wave-l
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408-654-9500
