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Automated full wafer inspection system for detecting particles as small as 0.10 micrometers on bare silicon and patterned process wafers, High throughput of up to 30 full wafer scans per hour on 150 mm wafers, High detection sensitivity even for difficult after-etch, develop, and chemical mechanical polishing. Double-dark field (DDF) laser scanning technology, the AIT is able to detect planar defects, microscatches and particulate contamination, Exceptional defect sensitivity, Reduced laser spot size concentrates the laser beam at the site of the defect, causing more light to scatter off the defect and less light to scatter off pattern and surrounding surface. Double-dark field laser scattering design, which combines a low angle of illumination with multiple collection optics placed close to the wafer horizon-maximizing the capture of defects while minimizing the capture of surface scatter, Real-time Die to Die signal processing for high throughput under all conditions, System capable of  full wafer inspection full die inspection on logic and array, also for pattern defects and contaminants, High speed CMP monitor, The AIT further improves on these advantages with a unique Process Variation Removal (PVR) algorithm that automatically compensates for variations in background scattering intensity caused by film non-unformities - dramatically increasing defect capture while minimizing false counts, AIT system is derived from the highly reliable Surfscan technology, and offer 90 percent system to system matching, map to map. Windows NT operating environment , Automated recipe set up. Integrated microscope with autofocus capabilities to speed recipe optimization and defect classification, Integrated classification and analysis.