|
Click To Enlarge
Email this page
Print this page
|
ADE Ultrascan 9300 Wafer Inspection System Features/Specifications:
- Non-contact capacitive probe measurement
- 10nm resolution,
- 400 to 1000 microns wafer thickness range,
- Capable of handling 100mm to 200mm wafers.
- Capable of measuring: lapped, etched, polished and patterned wafers,
- Measures bow and warp, site and global flatness, thickness,
The ADE Ultrascan 9300 Wafer Inspection System Consists of:
- 2 Cassette input stations,
- 3 Cassette output stations,
- Pre-aligner station, low resist station, flatness station,
- Dual end effector robot,
- Ultrascan controller,
- 9300 power supply, 350 arm controller,
- Unix computer and drive,
- ASC II,
- Teal power conditioner,
- Printer
For more information on this tool, click here. If you would like more information on Ultrascan series, click here.
|
408-654-9500
