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ADE Ultrascan 9350 Wafer Inspection / Sorter System Features/Specifications:
- Non-contact capacitive probe measurement with 10nm resolution,
- 400 to 1000 microns wafer thickness range,
- Capable of handling 100mm to 200mm wafers.
- Capable of measuring: lapped, etched, polished and patterned wafers
- Measures bow and warp, site and global flatness, thickness,
- 2 cassette input stations,
- 3 cassette output stations,
- Pre-aligner station,
- High Res resist station,
- Flatness station,
- Single end effector robot,
- Ultrascan controller,
- 9300 power supply,
- 350 arm controller,
- Unix computer and drive,
- ASC II,
- Teal power conditioner,
- Printer.
For more information on this tool, click here. If you would like more information on the Ultrascan series, click here.
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408-654-9500
