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The highly efficient Model SWC111 is the ideal solution for submicron cleaning of sawed/scribed wafers and other substrates. This very reliable and cost effective system utilizes a proven high pressure de-ionized water spray. The rapid and effective drying technique combines high spin speeds, nitrogen assist and an infrared heat lamp. The SWC111 is capable of processing wafer output of up to three saws while cleaning consistent with the most rigorous bonding and packaging requirements.
Ultra T Cleaner SWC111M Features/Specifications:
- Up to eight (8) inch wafer compatibility including unmounted wafers as well as tape ring and film frame mounted wafers
- Oscillating high pressure D.I. water fan jet assembly, adjustable to 2500 PSI, for effective and efficient cleaning
- Nitrogen blow-off for rapid and effective
- Dry Infrared heat lamp for complete drying
- Built in vacuum wafer hold-down
- Efficient chamber exhaust and drain
- Nitrogen wafer lift at end of cycle
- D.I. water line purge
- Built-in exhaust blower
- Built-in safety interlocks and positive lid locking during process cycle
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408-654-9500
