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Fusion 150 PC Photostabilization System Features/Specifications:
A photostabilization system with 4" to 6" wafer capability. It's a cost-effective, one-step solution for photoresist stabilization of 75-150mm wafer substrates.
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Software Rev. 4.4
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Cassette to cassette handling
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Process combines an intense UV light exposure with a programmable increase of the semiconductor photoresist/substrate temperature
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Fully automated microprocessor control
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Transporters: Robotic pick and place
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Lamp Functions: Off, Flash, Low, High
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Chuck Temperature Range: 50-240°C (User selectable)
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Chuck Temperature Ramp Rate: 0.5-2.5°C/sec. range, (User defined with maximum rate dependent on substrate)
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408-654-9500
