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ADE 6034 Microsense Features:

• Measures: Wafer thickness total, Thickness variation (TTV), Flatness, bow and warp.
• Non-contact
• Accurate
• Digital display
• Wide operating range
• ASTM standard

ADE 6034 Microsense Specifications:

• RANGE:
  • Thickness: 0-1000.0 microns, 0-40.00 mils
  • TTV, Warp, Bow: 0-250.0 microns, 1-10.00 mils
  • Accuracy:+/- 2.5 microns, 0.1 mils
  • Precision: 1.3 microns, 0.05 mils (1 sigma)
  • Resolution: 0.1 micron, 0.01 mils
  • Wafer Rings Parallelism: 1.3 microns, 0.05 mils
  • Flatness Precision: 1.3 microns, 0.05 mils
  • Limits: User settable high and low with front panel LED indication of high or low out of range condition.
•  POWER REQUIREMENTS: 115+/- 15 VAC, 50-60 Hz Standard 230+/- 30 VAC, 100 +/- 10 VAC Optional