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The UV-1050's field-proven pattern recognition, extensive analysis software, and high reliability add up to an advanced thin film measurement tool with the lowest cost of ownership in its class.
KLA-Tencor UV-1050 Features/Specifications:
- Thickness Range:
- Oxides: <20Å to 25µm
- Nitrides/Oxynitrides: <40Å to 25µm
- Photoresists/Polyimides: <500Å to 15µm
- Oxide on Poly: <100Å to 1.0µm oxide on >500Å poly
- Poly on Oxide: 200Å to 2.0µm poly on 80Å to 4000Å oxide
- Poly on Nitridie: 200Å to 2.0µm poly on 80Å to 4000Å nitride
- Amorphous Silicon: 200Å to >1.0µm; amorphous Si on 80Å to 4000Å oxide
- Oxide on Aluminum: <1000Å to >25µm
- Oxide on Tungsten: <1000Å to >25µm
- Simultaneous Multilayer
- Transparent on transparent: Total thickness of top 3 layers >300Å
- Oxide on Poly: <100Å to 1.0µm oxide on >500Å poly
- Throughput:
- 90 monitor wafers per hour (200mm), pre-programmed focus
- 75 pattered wafers per hour (200mm), pre-programmed focus
- 39 patterned wafers per hour (200mm), auto focus
- Absolute Accuracy:
- Thickness: 125Å to 250Å ± 2.5Å of NIST certified range; 250Å to 1.0µm ì 1% of NIST certified range
- Measurement Time: 1.5 - 5 seconds typical per site
- Mapping: Die, contour, 3-D
- SUMMIT Software
- Diameter scanning
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