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An automatic inspection tool that inspects both sides of diced wafers for any chipping or cracking. It also monitors kerf chipping sizes, kerf width, misalignment, as well as the proximity of damages to the edges.
The InspecTech KIS 2000 Features/Specifications:
- Compatible with wafers up to 300mm in diamater
- PC Pentium MMX 2000 MHz
- Windows NT operation system
- Matrox PCI frame grabber
- Z stage - 25mm/0.1µm accuracy
- 2.5x to 10x microscope
- Black and white CCD high resolution camera
- Automatic wafer loading (optional)
- Wafer inking (optional)
- Maximizes yield
- Stores defect information
- Statistical process control
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408-654-9500
