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A 3 source sputtering system with sputter etch capabilities. This 4 target sputtering system has a PC controller and load lock.
The Perkin Elmer 4400 Sputtering System Features/Capabilities:
- 3 source system 2/Deposition and 1/RF DC bias
- Main processing system with load lock
- Capable of large substrate pallet
- Auto pumpdown control
- Auto load lock and pallet control
- Sequential deposit of up to 4 films
- Gas control system
- 3 gas capability
- Pressure control
- CTI Cryo pump with compressor
- RF and DC sputter deposition capability
- Capable of round targets
- 8" round cathodes
- Water cooled substrate holder
- Table rotation adjustable from 1 to 10 RPM
- RF plasma products generator
- Turbo pumped process chamber
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408-654-9500
