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Single Wafer

The GaSonics International Aura 3010 is the latest in a series of highly successful and proven downstream photoresist removal systems. This damage-free asher advances the Aura series by offering enhanced reliability. (>400 hours MTBF) and closed loop temperature control at the wafer, allowing for maximum process control and flexibility.

Features

  • Fully automated downstream microwave asher
  • High capital productivity – 400 hours. MTBF
  • Closed loop temperature control at the wafer
  • Small footprint
  • No plasma damage
  • High throughput
  • SMIF compatible
  • Lamp heating for slow or fast heat ramp
  • Microwave, lamp, and endpoint detector monitors for guaranteed process performance
  • Computer controlled, multiple-step capability
  • 125mm-200mm capability
  • SECS II interface, optional

Applications

  • Bulk resist removal
  • Implanted and damaged photoresist
  • Non-oxidizing metal processing
  • Descum

Product Specifications
125-200 Millimeter

Process
Gas Flows O2=1000-10,000 sccm
N2=100-1000 sccm
N2/H2=100-2000 sccm
Pressure
0.5->5.0 torr
Microwave Power
0-1400 watt at 2.45 GHz
Wafer Temperature
90-300 C°
Throughput (1.2 µm. blanket softbaked resist ashed to end point, except for descum <300 Å.)
  Bulk resist removal 45-60 WPH
Implanted & damaged photoresist 20-50 WPH
Non-oxidizing metal processing 40-60 WPH
Descum 45-60 WPH
Uniformity (i Sigma ashed to 50% of >1.2 µm resist)
  Within a wafer 2%-5%
  Wafer to wafer (average) 2%-4%(avg.)
Ash Rate <200 Å- >2.5 µm./min
System Matching 2%-5% (I sigma)
Mobile Ion Concentration IEI0/cmP2-IEII/cm2
CV Shift <0.1 volt
Particle <0.5/cm2, size of 0.2 µm.
Reliability
MTBF >400 hr. (6 mo. after sign-off)
MTBA > 100 hr.
MTTR < 3 hr. for 80% of all downs
MTTA <5 min.
UPTIME (SEMI E10-92 STD) 90-90% (Equip. dependent uptime; must meet specific support requirements)
General Information
Substrate size 5-8”/125mm-200mm
Footprint 30”(75cm)W x 51.5”(128cm)D x5 8”(145cm)H
Electrical 200-240 VAC, 3 Phase, 50/60 Hz.
  WYI configuration, 40 Amp breaker
Typical Process Gases O2, N2,/H2,N2,--regulated 18-23 PSIG


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GaSonics Technical Specifications

GaSonics Ashing Systems
Aura 1000
Aura 2000-LL
Aura 3010
IPC L3500
IPC L3510

GaSonics Plasma Etch
7100 Series

 

See our inventory of GaSonics equipment available for purchase