Surplus Process Equipment Corporation
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Image Product Details Inquiry
ADE 8100 Microscan

Measures wafer thickness, bow, warp, site flatness, and global flatness.

 
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ADE UltraGage 9500

Measures thickness, shape stress, global and site flatness. Multifunction dimensional measurements for 500 nm design rule. Supports 4" to 8" wafers..

 
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ADE Ultrascan 9300 Wafer Inspection System

Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers.

 
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ADE Ultrascan 9350 Wafer Inspection / Sorter System

Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers.

 
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AG Associates 4100 Heatpulse

Rapid Thermal Processor System. Wafer Capability up to 6"

 
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AG Associates 610 Heatpulse
Rapid Thermal Processor PC Controller - 2" to 6" Wafers Capability
 
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AG Associates 8108 Heatpulse

Rapid Thermal Processor System, Single Wafer Processing Capability up to 8".

 
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AG Associates Heatpulse 410
Rapid Thermal Processor, PC Control Capability of 2" to 5" Wafers.
 
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Alcatel BF ADP30 Vacuum pump with cart & control unit
Alcatel BF ADP30 Vacuum pump with cart & control unit
 
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ASQ Technology Wafer Transfer Unit - 8-Inch

Model : AT2S8  - (2 available)

 
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August Technology / Nanometrics NSX-80 Automated Defect Inspection System

Automated vision-based defect-inspection system performs 25,000 pass/fail quality wafer and die checks a day compared to manually screening and classifying a few thousand die per day.

 
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Blue M DCC 146C
14X14x11 (3 inch spacer in oven) would be 14 Inside Chamber , 46Hx 30Wx 26 ½ L
 
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Blue M Model DCC-146C
Cleanroom Oven
Chamber size : 14" H x 10.5" W x 14" D

 
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Blue M OV-12A Gravity Convection Oven

A gravity convection oven with stable therm temperature convection control.

 
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Blue M Oven DC-146C
14x14x14 Inside oven chamber 42Hx30Wx22 ½L outside chamber
 
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Branson IPC 4000 Barrel Asher

Barrel asher - wafer capability up to 8"
Chamber size: 10" W x 23"D

 
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Branson IPC L2101

Branson/IPC Mod. S2100-11220 Reactor Center, w/1ea 12"(dia) x 20"(D) quartz chamber.

 
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Branson IPC L3200

Dual quartz chambers for 100-150mm wafers, cassette to cassette operation.

 
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Canon MPA 500 Projection Mask Aligner

Auto Feeder: Single, cassette to cassette, backside wafer handling
Wafer size: currently 5" (4" and 3" sizes available)

 
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Canon MPA 600FA Mirror Projection Aligner

This mirror projection aligner has a single auto feeder. It is cassette to cassette and also has backside wafer handling.

 
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Canon PLA 501F Parallel Light Mask Aligner
Parallel Light Mask Aligner Cassette to cassette mask aligner can be used manually or in auto mode. Mask aligner for 2"-5" wafers.
 
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CHA Industries Mark 50 Source Evaporator

 Full computer control to manual operation. Chamber 32" diameter by 32" long process. Dual operation, sputtering and evaporation.

 

 
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CHA Industries SE 1000 E-Beam Evaporation System
An evaporation system with a 25.5 inch diamater stainless steel water cooling chamber. Also features a 6 pocket Telemark E Gun 15CC.
 
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CHA Industries SE 600 E-Beam Evaporator

An electron beam evaporation system with a 4 pocket E-gun.

 
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Convergent 3000 Mask Coater with Bake

Resist coat tool for mask substrates for use in advanced mask writing application.

 
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